1974 Brain Box saves the day.
Continuing on from Post #60
@BillGrissom
@pishta
@halifaxhops
What do you guys think about the compound inside the LX100 ICM where the internal heat sink tab is pasted together with the inner skin of the ICM? Would that be a thermal transfer compound, it is hard and black, and there looks like some thermal transfer tape in there too.
If that is indeed thermal transfer compound then a person would probably not need to mechanically fasten the internal heat sink to the ICM body and external heat sink.
I would think from an assembly point of view they would drop in the board and the heat sink goes down into the thermal compound at the same time. Then they put one rivet into the installed terminals and plastic connector housing to hold it all together. Then they fill with sand with a thin layer of epoxy over all that to seal it all up.
If this is the case I am thinking that this is more thermally efficient than I thought upon my first inspection (without being bolted together), giving the the internal heat sink tab a way to transfer the internal chip heat out to the external aluminum heat sink and out then to the surrounding atmosphere to get rid of it.
What are your thoughts on this ? Could maybe even add a couple heat sink wings to the external heat sink to make it pull the heat out even better ??
Continuing on from Post #60
@BillGrissom
@pishta
@halifaxhops
What do you guys think about the compound inside the LX100 ICM where the internal heat sink tab is pasted together with the inner skin of the ICM? Would that be a thermal transfer compound, it is hard and black, and there looks like some thermal transfer tape in there too.
If that is indeed thermal transfer compound then a person would probably not need to mechanically fasten the internal heat sink to the ICM body and external heat sink.
I would think from an assembly point of view they would drop in the board and the heat sink goes down into the thermal compound at the same time. Then they put one rivet into the installed terminals and plastic connector housing to hold it all together. Then they fill with sand with a thin layer of epoxy over all that to seal it all up.
If this is the case I am thinking that this is more thermally efficient than I thought upon my first inspection (without being bolted together), giving the the internal heat sink tab a way to transfer the internal chip heat out to the external aluminum heat sink and out then to the surrounding atmosphere to get rid of it.
What are your thoughts on this ? Could maybe even add a couple heat sink wings to the external heat sink to make it pull the heat out even better ??
